Product Introduction : An industrial-grade paper used in the thermal pressing process for electronic components such as FPC (flexible printed circuits) and PCBs (printed circuit boards), primarily serving as a buffer, heat insulator, and anti-adhesive barrier during lamination to ensure high-quality product bonding.
Product Features : High-temperature resistance: Maintains structural stability even in high-temperature lamination environments, preventing carbonization and deformation—and avoiding paper damage that could contaminate the circuit board.
- The surface is clean and smooth, with no impurities, holes, or wrinkles on the paper. When pressed against the circuit board, it adheres tightly, ensuring a uniform product thickness and preventing any unwanted creases or marks.
- Balances cushioning and heat transfer effectively, with controllable fiber structure porosity—providing both optimal cushioning against compression pressure (preventing component damage) and ensuring uniform heat distribution, thus guaranteeing consistent bonding performance across all areas of the circuit board.
- Excellent anti-adhesion properties: the paper surface undergoes a special treatment, ensuring that it doesn’t easily stick to circuit boards or steel plates after lamination, making subsequent peeling easier and reducing process-related losses.
Product Categories : General-purpose heat press paper, high-temperature specialty heat press paper
Product Quantification (150–200) g/m 2
Keywords:
High-Temperature Heat-Pressing Backing Paper
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